Adaptive Micro-Assembly Inspector (AMAI)

In high-precision electronics and micro-assembly manufacturing, surface-mount technology (SMT) defects—such as solder bridges, skewed QFP chips, and soldermask micro-fractures—cause catastrophic field failures if undetected. Traditional automated optical inspection (AOI) machines are brittle, rigid, and disconnected from robotic manipulation. **AMAI** closes the perception-action-supervision loop: 1. **Simulated Physical AI Workcell:** A calibrated PyBullet digital twin with an overhead RGB-D camera and a 6-DoF SO-ARM100 robotic manipulator with parallel jaw gripper. 2. **Procedural Defect Synthesizer:** Real-time generation of realistic PCB substrates, IC chip packages, copper traces, and injected micro-defects (solder bridges, skew tolerances, fractures). 3. **Intel OpenVINO Edge Vision:** Deep neural defect detection running at **0.24 ms** per board with 2D-to-3D projection into world coordinates. 4. **VLA Motion Planning:** Collision-free grasp affordance reasoning avoiding keep-out zones and generating smooth multi-waypoint trajectories to sort units into Pass vs. Scrap/Rework bins. 5. **Speechmatics Voice Supervision:** Real-time speech streaming allowing human operators on the factory floor to issue verbal overrides, freeze lines during safety events, or flag recurring defects hands-free. 6. **Immutable QA Audit Trail:** Persistent SQLite and JSON audit logging capturing every unit's telemetry, visual defect classification, confidence, 3D coordinates, and voice transcripts.